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Home1 / Data Center
sidecar
Application Notes, Data Center

LIC, BBU and the 1–50 ms Window: Transient Management in the 800 V Sidecar

Application Note · Data Center

LIC, BBU and the 1–50 ms Window: Transient Management in the 800 V Sidecar

How Lithium Ion Capacitors, battery backup units and SCMI power capping deal with AI workload power transients in 800 VDC rack architectures.

Contents

  1. The 1–50 ms window: why it matters
  2. The SCMI management framework: power capping and PID loop
  3. LIC and BBU: the state of the art at rack scale
  4. Implications for the sidecar power converter
  5. Lessons from railway power electronics

The 800 V sidecar solves the problem of power distribution to the compute rack. But it does not solve the problem of the power transients that AI silicon workloads generate on millisecond timescales. That window — between 1 and 50 ms — is the territory of the Lithium Ion Capacitor (LIC) and the Battery Backup Unit (BBU), and it is also territory where the discipline of industrial power electronics has a direct and immediate application.

The 1–50 ms window: why it matters

Artificial intelligence workloads generate power transients that did not exist in the previous generation of data centres. When a GPU cluster initiates an intensive compute phase — the first token of an inference, the start of a training step — power demand can ramp in milliseconds from an idle value to the rack’s maximum power. That power step has two consequences.

The first is electrical: the facility rectifier and distribution system cannot respond fast enough. The bus voltage momentarily drops until the supply chain stabilises. If that voltage drop exceeds the silicon’s tolerance threshold — typically ±5% of nominal — the GPU controller activates the throttling mechanism, reducing clock frequency until the voltage recovers. The result is a direct degradation of compute performance.

The second consequence is mechanical and reliability-related: repeated load step and unload cycles accelerate ageing of decoupling capacitors, power modules and rack converters. In racks of 125–140 kW such as NVIDIA’s NVL72, the energy involved in those transients is sufficient to damage components dimensioned for steady-state operation if it is not actively managed.

The SCMI management framework: power capping and PID loop

The OCP EMEA Summit 2026, held in Barcelona in April 2026, added a new dimension to the transient problem: coordinated management from the Data Centre Manager (DCM) level. A joint session by Oracle, AMI and Arm presented Arm SCMI (System Control and Management Interface) as the standard protocol for the DCM to impose power policies at the silicon and power converter level.

The POWERCAP_CAP_SET and POWERCAP_CAP_GET power capping commands allow the DCM to set a consumption ceiling per power domain. Levels CPL0 to CPL3 define four degrees of restriction, from the sustained level (CPL0) to the critical level (CPL3). Concurrent Power Capping (CPC) enables simultaneous restrictions across multiple domains.

The interaction with the closed thermal loop is equally relevant. Without a closed loop coordinating cooling with silicon power demand, the only response to a thermal transient is processor throttling — a performance degradation. With the DCM’s PID loop acting on pumps, valves and CDU flow rate, the system can increase cooling before the silicon reaches its thermal limit, preserving compute performance.

LIC and BBU: the state of the art at rack scale

The reference solution for transient management in the AI rack is a two-stage temporal architecture. The Lithium Ion Capacitor (LIC) covers the ultra-short window of 1 to 50 ms — the energy needed to hold the rack bus while the supply chain responds to the load step. The Battery Backup Unit (BBU) covers the seconds-to-minutes window — the backup needed for an orderly shutdown or to ride through micro-outages.

The LIC is neither a supercapacitor nor a lithium-ion battery. It is a hybrid technology that combines the high specific power of the supercapacitor with an energy density intermediate between the supercapacitor and the battery. In the rack context, a LIC module at rack scale typically provides between 100 and 500 Wh of usable energy with a discharge power of 10–50 kW for the 1–50 ms window, in a format compatible with standard rack U-space. The cycle life of a LIC — typically above 100,000 cycles at 80% depth of discharge — is compatible with the daily cycle count of an AI rack in production.

Implications for the sidecar power converter

For the sidecar converter, the two-stage LIC + BBU architecture implies specific design requirements. The 800 V DC bus must support the connection of LIC and BBU modules without intermediate conversion — which requires that bus voltage tolerance and protection coordination are designed for bidirectional energy flows. The converter supervisor must expose telemetry at the granularity and latency the DCM’s PID loop needs: instantaneous output power, semiconductor temperature, transformer temperature and instantaneous efficiency, updated at intervals below 100 ms.

The converter must also respond to SCMI POWERCAP_CAP_SET/GET commands in times consistent with the control loop dynamics. This is a firmware requirement that today is not standardised in most industrial converters, and one that converter manufacturers will need to address.

Lessons from railway power electronics

The transient management problem in the AI rack is structurally similar to two problems Premium SA has addressed in the railway environment: the management of regenerative braking transients in traction auxiliaries, and the management of load disconnection transients in EN 50155-certified on-board systems. In both cases, the critical window is in the range of tens of milliseconds, the energy involved is in the range of hundreds of watt-hours at power levels of tens of kilowatts, and the reliability requirement is above 99.9% availability over a lifetime of ten to twenty years.

The engineering approach applied to railway traction — conservative derating, accelerated thermal cycling qualification, FMEA at component level — is the same approach that the 1–50 ms transient management problem in the AI rack demands.

References

  • Oracle, AMI, Arm — Systems Management session, OCP EMEA Summit 2026 (Barcelona, April 2026): Arm SCMI power capping architecture.
  • Open Compute Project Foundation — Data Center Facility: Low Voltage DC Power Distribution white paper v1.0 (approved April 2026).
  • NVIDIA — GB200 NVL72 rack power specification.
About Premium SA — Premium SA is a Barcelona-based designer and manufacturer of custom power converters for railway, energy, industrial, data centre and defence applications. Founded in 1981, the company brings over 40 years of experience in high-reliability power electronics.

Power designed for your application

Talk to our engineering team about power conversion for 800 VDC data centre architectures.

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Application Notes, Data Center

Engineering the Power Stack for AI Data Centers

Engineering Insight · AI Data Centres & HPC

Engineering the Power Stack for AI Data Centers

Custom mission-critical power electronics for AI factories, HPC clusters and hyperscale data centres — >97% efficiency, >1 kW/L density, MTBF >10⁶ h

40+
Years in mission-critical power
>900
Custom designs delivered
>97%
Efficiency target
>10⁶ h
MTBF baseline

Three barriers between AI and reliable power

Generative AI and HPC workloads are creating unprecedented demand for power infrastructure. Rack densities are growing 10× in five years. Hyperscale operators demand Titanium-class efficiency. AI factories tolerate zero downtime. Three barriers define the engineering problem — and all three must be solved simultaneously.

Efficiency: >97%

Titanium-class efficiency at every conversion stage. Every percentage point saved at 1 MW means 10 kW less heat — and a real capex reduction in cooling infrastructure.

Power density: >1 kW/L

Rack density is growing from 10–15 kW/rack to 200+ kW/rack by 2028. WBG semiconductors (SiC, GaN) and planar magnetics are the only viable path to meet these targets.

Reliability: >10⁶ h MTBF

AI factories run 24/7 with zero tolerance for downtime. Physics-of-Failure design, RAMS analysis and thermal budget management are non-negotiable engineering requirements.

Mission-critical power engineering, now for AI infrastructure

Premium PSU is not entering the data centre market from zero. We are transferring over 40 years of engineering experience from railway traction (EN 50155, EN 61373), defence and grid infrastructure — sectors where failure is simply not an option — into a market that now demands exactly those same standards.

Capability Focus What it means in practice
WBG semiconductors SiC · GaN · Ga₂O₃ Baliga FOM-driven device selection. SiC for high-blocking-voltage stages; GaN for high-frequency switching. Gate-driver design, EMI management and long-term reliability qualification in-house.
Thermal engineering RAMS · phonon engineering 55% of power electronics failures are thermally driven. We apply Coffin-Manson fatigue modelling, thermal budget allocation and advanced substrates (Si₃N₄, AlN) from prototype to production.
Digital control FPGA · SoC · predictive control High-bandwidth digital loops, model-based design (MiL→SiL→HiL). Real-time telemetry via PMBus, SNMP, Modbus and REST. Full DCIM integration out of the box.
Passive components Magnetics · capacitors Custom inductors and transformers with nanocrystalline/ferrite cores. Elimination of electrolytic capacitors in critical paths — historically 35% of field failures.

CPD-Ready 125V DC Kit — from pilot to hyperscale

Turn-key power infrastructure for AI compute, designed for native OCP Open Rack v3 (ORv3) architecture and full DCIM integration. Available in four power configurations — 20, 40, 60 and 72 kW — to match rack density targets from edge to AI factory scale.

  • N+1 redundancy: hot-swap modules with seamless failover — zero downtime during maintenance windows.
  • OCP ORv3 compliant: native support for the Open Compute Project Open Rack v3 architecture.
  • Unified telemetry: SNMP / Modbus / REST — full integration with DCIM platforms.
  • Pre-validated EMC: CE, IEC 62368-1, UL ready — integrated EMC-checked BOM.
  • WBG switching stages: SiC-based conversion for >95% efficiency at full load.
  • Co-development ready: custom configurations of voltage, form factor, firmware and interface.

Standard catalogue models for data centre architecture

Model DC application Key adaptation Power range
CKR-3600 Modular 48V front-end rectifier ≥97% eff., OCP ORv3 hot-swap, PMBus/SNMP Up to 3.6 kW/module
CRS-2000 / 3000 DC-DC mid/high power (48V ↔ 380V) PMBus telemetry, >1 kW/L density 2–3 kW
ODS-1500 / 3000 AC/DC isolated front-end, edge Modular scaling, >95% peak, Titanium 1.5–3 kW
EPS-200 / 2000 DC UPS — edge and critical rooms Li-ion modular, bidirectional, SNMP 200 W – 2 kW
ODX / OVX-6000 Resilience inverters and microgrid 19″ rack, remote control + telemetry Up to 6 kW

Over 40 years engineering power where failure is not an option

Our engineering credentials come from the most demanding industrial applications. Every methodology we apply in AI data centre projects — Physics-of-Failure, RAMS, thermal budget analysis — has been validated under real-world mission-critical conditions:

  • Railway traction and high-speed rail: converters and inverters qualified to EN 50155, EN 61373 and EN 45545-2, including cold-start designs for −40 °C arctic operation and cross-border certification management. The same thermal and reliability design methodology applies to AI rack power.
  • Urban rail systems: full RAMS analysis and EN 61373 vibration qualification, with rapid prototyping cycles.
  • Grid infrastructure: modular inverter deployments across distribution networks. Grid-grade reliability and modular architecture are directly applicable to DC microgrid and AI campus designs.

Power electronics for AI data centres — technical Q&A

What power electronics does Premium PSU offer for AI data centres?

Premium PSU offers custom power electronics for AI data centres, including the CPD-Ready 125V DC Kit (20/40/60/72 kW, OCP ORv3 compliant), modular 48V rectifiers (CKR-3600), DC-DC converters (CRS-2000/3000), AC/DC isolated front-ends (ODS-1500/3000) and DC UPS systems (EPS-200/2000). All products feature SiC/GaN WBG switching for >97% efficiency, PMBus/SNMP/REST telemetry and N+1 redundancy design.

Is Premium PSU OCP ORv3 compliant?

Yes. The CPD-Ready 125V DC Kit is designed for native OCP Open Rack v3 (ORv3) architecture, supporting hot-swap modules, N+1 redundancy and full DCIM integration via PMBus, SNMP and REST interfaces. Premium PSU actively monitors OCP specifications and roadmaps to maintain alignment.

What is the MTBF of Premium PSU power supplies for data centres?

Premium PSU standard platforms achieve MTBF >10⁶ hours, validated through Physics-of-Failure (PoF) design methodology and RAMS (Reliability, Availability, Maintainability and Safety) analysis applied from day one of each project. Thermal budget allocation, Coffin-Manson fatigue modelling and elimination of electrolytic capacitors in critical paths are standard practice.

Can Premium PSU co-develop custom power solutions for AI infrastructure?

Co-development is at the core of how Premium PSU works. We assign dedicated engineers, run co-simulations, and optimise thermal and electrical budgets together with the customer. An NDA is signed on day one. Prototype delivery in under 14 weeks is our demonstrated standard. Custom configurations include voltage levels, form factors, firmware, communication interfaces and mechanical integration.

What efficiency class do Premium PSU AI data centre products achieve?

Premium PSU products target ≥97% efficiency at rated load, meeting Titanium-class requirements (80 PLUS Titanium, ≥96% at 50% load, ≥94% at 20% load). WBG SiC-based switching stages and planar magnetics are the primary enablers. Efficiency is guaranteed across the full operating temperature range for data centre environments.

What certifications do Premium PSU AI data centre products carry?

Products are certified or in certification for IEC 62368-1, CE (EU), UL (North America) and Energy Star. The CPD-Ready 125V DC Kit also targets 80 PLUS Titanium qualification. EMC compliance (CISPR 32, IEC 61000) is validated in-house at Premium PSU’s EMC laboratory in Barcelona.

About Premium PSU

Premium PSU (Premium SA) designs and manufactures custom power supplies and power converters in Barcelona, with over 40 years of experience in railway, energy, industrial, data centre and defence applications.

Talk to our engineering team

Discuss your power conversion requirements with Premium PSU.

Contact us

datacenter
Application Notes, Data Center

The Hyperscale Data Centre as a New MV Load

Engineering Insight · Data Centre · MV Grid Interface

The Hyperscale Data Centre as a New MV Load

What changes for the DSO when AI connects to the distribution grid: primary AC/DC conversion, grid-support services and mitigation assets at the point of connection are redefining the quality contract on the European distribution network.

Premium SA
Born in Barcelona, Powering the World
36 TWh
Data centre electricity demand, Europe (2025)
945 TWh
Projected global data centre demand (2030)
125–140 kW
Per GB300 NVL72 rack
100 ms
Time scale of AI training load transients

AI load no longer resembles a classic industrial load

Three structural differentiators separate the load of an AI campus from that of a traditional data centre.

Power density per rack

NVIDIA Blackwell Ultra dissipates 1.4 kW per GPU. A GB300 NVL72 rack dissipates between 125 and 140 kW. The 2026–2028 frontier is 200 kW per rack, with a 1 MW horizon. This density has no precedent in classic industrial grid connection.

Dynamic time profile

AI training cycles aggregate and release tens of MW on sub-second time scales. Distributed inference modulates the load in the 0.1–10 Hz range, within the flicker and power-quality disturbance band monitored by DSO analysers.

Geographical concentration

An AI campus aggregates 50–200 MW in a footprint of a few hectares, something historically seen only in heavy industrial plants with a dedicated HV connection. The 2025–2026 transition to bipolar 800 V DC architectures, driven by NVIDIA and leading power-infrastructure manufacturers, concentrates primary AC/DC conversion at a single point.

Frankfurt, London, Amsterdam, Dublin, Madrid, Paris: hyperscale hubs are redefining MV feeder planning and investment cycles on the distribution network.

Four measurable effects at the point of common coupling

These are the effects captured by power-quality analysers at the head of an MV feeder with an active AI campus downstream.

Effect at the PCC Physical origin in the AI load Implication for the DSO
Voltage dips and ride-through Sub-second power ramps at training start-up; synchronised start-up of GPU banks generating abrupt load steps. HV→MV→LV propagation in adjacent Dy networks; industrial customers sensitive to Type I and II dips. A 0.5 p.u. dip at MV propagates as 0.73/0.48 p.u. on the LV side.
Harmonic distortion (THD) and interharmonics AC/DC rectifiers in the 800 V DC front end; SiC switching with sub-5 ns rise times generating broadband harmonic content. Risk of EN 50160 non-compliance on shared feeders; active filtering or reinforcement required at the MV substation.
Flicker and low-frequency oscillations Load modulation by inference/training cycles in the 0.1–10 Hz range. Systematic and semi-periodic, unlike classic industrial process flicker. Pst and Plt in the residential-complaint range for customers connected to the same MV/LV transformer. DSO responsibility under EN 50160.
Unbalance and sequence components Non-homogeneous load distribution per phase, with single-phase sidecar racks in three-phase campus installations. Neutral overload, additional transformer heating and degradation of feeder equipment. Accelerated ageing of distribution assets.

The mitigation chain: from the rack to the PCC

Four coordinated layers with distributed allocation of the dynamic response. A poorly sized layer degrades the technical contract of the whole.

Layer Function Topology Premium SA platform
01 · In-rack CBU Absorb sub-100 ms transients and hold the DC bus during grid events. EDLC supercapacitor bank + bidirectional DC/DC converter. Industrial DC/DC platforms with telemetry and BMS, derived from regenerative traction.
02 · Sidecar BBU Hold-up from seconds to minutes. Staggered restart after a dip or transfer. Li-ion module + bidirectional DC/DC in a cabinet outside the compute rack. EPS line (sub-ms DC UPS) rescaled to an industrial sidecar · EN 50600 + OCP.
03 · Campus BESS + STATCOM Power-quality management at the PCC · reactive voltage support · peak shaving to reduce contracted MW. Multilevel Cascaded H-Bridge · three-phase AC bus at MV · Li-ion batteries + grid-forming control. CHB topology (grid-scale BESS and STATCOM, NC RfG 2.0 ready).
04 · Grid-forming PCS at the PCC Meet the connection contract: ride-through, damping ≥5%, current response <10 ms. The critical layer for the DSO. Multilevel inverter with certifiable Virtual Synchronous Machine (VDE FNN where applicable). ODX/OVX-6000 platform: MV grid-forming adaptation with D4Co dossier.

Regulatory framework: the DSO perspective

European grid codes are tightening the real-time technical connection contract.

ENTSO-E NC RfG 2.0, Phase II

Current response <10 ms · damping ≥5% on electromechanical oscillations · full ride-through of phase-angle jumps · compliance with the mechanical starting time method for virtual synchronous systems. Threshold: any BESS or renewable plant >1 MW. Its transposition to the data centre as a grid-interactive load is an open area of regulatory discussion; CIRED 2026 (Dublin, June 2026) was one of the forums where that discussion was being formalised among European operators.

German inertia market (28 January 2026)

First published European inertia price, with four product categories and mandatory VDE FNN certification. A data centre with a bidirectional BESS and a compliant PCS is technically in a position to bid for those contracts, turning mitigation infrastructure into a monetisable asset that improves the business case of the connection.

UK Pathfinder: Blackhillock

First commercial Virtual Synchronous Machine plant in operation, demonstrating grid-forming performance under real grid conditions. It is the benchmark for what an NC RfG 2.0-class system must deliver commercially, not only in laboratory certification.

Iberian blackout (28 April 2025)

The most widely read case study in Europe on cascades caused by low residual inertia. Direct evidence of the consequences of an under-specified dynamic response at points of connection, including large loads with passive PCS. The event has accelerated DSO requirements for documentation of dynamic response in new connection agreements.

The Premium SA proposition

Over 40 years of mission-critical industrial power electronics, mapped to the grid interface of the hyperscale market.

ODX/OVX-6000

Rugged inverters for critical microgrids: the base on which bidirectional PCS with Virtual Synchronous Machine (VSM) and sub-second response are developed. Main adaptation: migration of the control to an NC RfG 2.0-compliant architecture, with an auditable dossier for the DSO generated from the D2W gate.

EPS line

DC UPS with sub-millisecond response and fast transfer certified in critical railway applications. Rescaled to the industrial data centre sidecar, it covers the BBU/CBU layer without structural platform modification; it only requires additional qualification gates for EN 50600 and, where applicable, OCP.

CHB topology

Cascaded H-Bridge: pure modularity · no capacitor-balancing issues · fault tolerance through cell bypass · natural isolation per cell. It is the canonical topology for the grid-scale BESS + STATCOM segment on data centre campuses, where the inertia or voltage-support contract becomes bankable before the DSO or the ancillary services market.

D4Co methodology

Design for Compliance: from the first D2W gate, the dossier that the operator will submit to the DSO or the regulator so that the connection is approved and the grid-support services provided are remunerable. Derived from over 40 years of railway RAMS, derating to 80% of Tj,max and post-deployment FRACAS. It turns a technically good PCS into a contractually bankable PCS.

Technical excellence is not enough: bankable compliance is what makes the difference.

The boundary between data centre and grid is not a cable: it is a well-designed PCS

When a European hyperscaler requests a new 50 or 100 MW connection from a DSO, the technical debate is no longer settled by sizing an additional transformer. It is settled by articulating a quality contract at the PCC: THD limits, ride-through profile, dynamic reactive power response and behaviour during phase-angle jumps. That contract requires equipment at the point of connection that behaves like the grid, not like a load.

Premium SA provides the industrial asset — ODX/OVX-6000, EPS, CHB topology — and the D4Co methodology that turns the operator’s technical specification into an auditable compliance dossier. When the difference between award and rejection is measured by the quality of the technical dossier, that discipline is decisive.

Talk to our engineering team

Defining the grid interface of a data centre campus? Our engineering team can help you size the conversion and mitigation chain from the rack to the point of connection.

Contact Premium SA

About Premium SA

Premium SA (Premium PSU) is a Barcelona-based designer and manufacturer of custom power supplies and power converters for railway, energy, industrial, data centre and defence applications, with over 40 years of experience since its foundation in 1981. Born in Barcelona, Powering the World.

© 2026 Premium SA · Barcelona, Spain · Born in Barcelona, Powering the World
data center
Application Notes, Data Center

Manageable Power Converters: PMBus, Redfish and SCMI in the 800 VDC AI Data Centre

Application Note · Data Center

Manageable Power Converters: PMBus, Redfish and SCMI in the 800 VDC AI Data Centre

Which protocols sit between the data centre manager and the power converter, where each one fits, and what the converter firmware needs to provide.

For decades, the relationship between a power converter and the system around it was almost one-way: the load demanded power and the converter supplied it. Signalling was limited to an enable signal, a fault signal and, at most, a voltage setpoint.

In the AI rack, that model is no longer enough. As rack power grows towards 800 VDC distribution architectures (covered in The 800 VDC revolution), the data centre manager needs to know at all times how much power each conversion stage is delivering, how much thermal margin it has and whether there are any alarms. The converter stops being a passive element and becomes a managed node.

This note explains which protocols are involved in that management chain, where each one fits and which firmware capabilities a converter needs to integrate into it.

The management chain: from the data centre manager to the converter

No single protocol links the data centre manager to the converter. Management is organised in layers, and each layer uses a different standard:

Layer Typical protocol Function
Data centre manager ↔ rack controller / BMC Redfish (DMTF), REST API over HTTPS Inventory, telemetry, alarms and power policies at facility scale
Rack controller ↔ power shelf / BBU shelf Modbus over RS-485 or CAN (common in Open Rack V3) Reading measurements and status from power and backup shelves
Controller ↔ power supply or converter PMBus Telemetry and control of each conversion unit
Inside the compute node Arm SCMI Power and performance management of the silicon, including power capping

For the converter manufacturer, the practical consequence is clear: the equipment must speak PMBus comprehensively and expose the information that the upper layers will translate into Redfish, either directly or through the shelf or rack controller.

PMBus: the converter’s own language

PMBus is the open digital communication standard for power supplies and converters. Its current published revision is 1.5. It defines a common set of commands to read measurements and status and to configure the equipment, for example:

  • Measurements: READ_VIN, READ_IOUT, READ_POUT, READ_TEMPERATURE_1.
  • Status and alarms: STATUS_WORD and the specific status registers (voltage, current, temperature).
  • Configuration: warning and fault thresholds, and operating setpoints.

A converter with a complete, well-documented PMBus implementation simplifies integration: the rack controller can read its data without custom development.

Redfish: the facility view

Redfish is the DMTF standard for infrastructure management through a REST API with JSON data. For power it defines specific schemas, including PowerSubsystem, PowerSupply and PowerSupplyMetrics, as well as a generic sensor model.

The converter does not always need to implement Redfish itself. Typically, the shelf or rack controller collects the PMBus or Modbus data from each unit and publishes it in Redfish. What is essential is that the converter provides all the information those schemas expect: power, voltages, currents, temperatures, efficiency and status.

SCMI: where it really fits

Arm SCMI (System Control and Management Interface) is a standard, transport-independent interface between system software and the platform control firmware. Its natural scope is inside the compute node, not the link to the power supply. It defines protocols for discovery (Base), power domains, system power management, performance, clocks, sensors, reset, voltage and power capping (Powercap).

The Powercap protocol includes, among others, the POWERCAP_CAP_GET and POWERCAP_CAP_SET commands to read and set the power limit of a domain, and POWERCAP_MEASUREMENTS_GET to read average power. Version 4.0 of the specification, still in draft, adds Concurrent Power Limits (CPL) per domain and a telemetry protocol.

How does this relate to the converter? Power capping is executed by the silicon through SCMI, but the decision to cap depends on telemetry from the whole power chain, including the converter: if its thermal or power margin runs out, the manager can reduce compute consumption before the conversion stage operates outside its safe operating area.

Closed-loop thermal control

In liquid-cooled AI racks, thermal control is usually organised in two nested loops. The inner loop, in the coolant distribution unit (CDU), keeps the coolant temperature close to its setpoint by acting on pumps and valves. The outer loop, in the manager, adjusts that setpoint and the power limits according to the thermal telemetry from the racks.

To take part in the outer loop, the converter must publish the temperature of its power semiconductors, the temperature of its magnetic components and its instantaneous efficiency. With that data, the manager can decide whether there is margin for a transient increase in demand or whether power should be limited to protect the equipment’s reliability.

What the converter firmware must provide

  • Complete PMBus telemetry: input and output voltage and current, power, internal temperatures and status registers.
  • Interface to the rack controller in the protocol specified by the integrator, for example Modbus over RS-485 or CAN.
  • Information compatible with the Redfish power model, published directly or through the controller.
  • Configurable limits and derating, with event and alarm notification.
  • Telemetry latency consistent with the control dynamics defined by the integrator.
  • Controlled, traceable firmware updates.
Operators building on open architectures are likely to make this management capability a purchasing criterion for power conversion equipment, just as EN 50155 conformity is today for on-board railway equipment.

References

  • Arm — System Control and Management Interface (SCMI), specification DEN0056.
  • DMTF — Redfish: PowerSubsystem, PowerSupply and PowerSupplyMetrics schemas.
  • PMBus — Power Management Bus Specification, revision 1.5.
  • Open Compute Project — Open Rack V3 specifications.

About Premium PSU

Premium PSU (Premium SA) designs and manufactures custom power supplies and power converters in Barcelona, with over 40 years of experience in railway, energy, industrial, data centre and defence applications.

Talk to our engineering team

Discuss your power conversion requirements with Premium PSU.

Contact us

The DC Power Standards Map for European AI Data Centres
Application Notes, Data Center

The DC Power Standards Map for European AI Data Centres

Standards · Data Center

The DC Power Standards Map for European AI Data Centres

Five principles, three architectures and an international alliance: who is writing the LVDC rules for the 800 VDC AI data centre, and what they mean for power electronics manufacturers.

Contents

  1. OCP DCF Power Distribution LVDC: the canonical document
  2. Schneider Electric WP213: five principles for adoption
  3. The OCP × Current/OS alliance: an open standard for DC
  4. IEC and the European standards landscape
  5. Implications for European power electronics manufacturers

The transition to low-voltage direct current as the distribution architecture of the European AI data centre is not only a hardware change. It is a standards and ecosystem change being built in real time, with the active participation of the sector’s principal industrial actors. The OCP EMEA Summit 2026, held in Barcelona in April 2026, was where that process took its most visible step: the approval of the OCP white paper on Low Voltage DC Power Distribution as a contribution to the Open Data Center Ecosystem for AI, and the presentation of Schneider Electric’s five principles for 800 VDC adoption.

This article maps the emerging standards territory — who is writing the rules, what the rules are, and what the implications are for European power electronics manufacturers that want to take part in this market.

OCP DCF Power Distribution LVDC: the canonical document

The OCP Foundation’s DCF Power Distribution LVDC white paper (version 1.0) was approved on 29 April 2026, the first day of the OCP EMEA Summit in Barcelona; OCP has since published version 1.1.0. Its co-leadership corresponds to Eaton and ABB, the volunteer co-leads of the OCP Power Distribution Project.

The document’s operational definition delimits the perimeter of the entire conversation: LVDC (Low Voltage Direct Current) is defined as direct voltage equal to or below 1,500 VDC. The 800 V bus — the ±400 V of the Mt. Diablo specification — falls comfortably within that range. The document specifically addresses LVDC distribution as the interface between incoming Medium Voltage AC (MVAC, currently in the facility grey space) and rack compute in the IT white space.

Of particular relevance to power electronics manufacturers is its treatment of MVAC-to-LVDC conversion — either via a Solid State Transformer (SST) or via a combination of a conventional MV/LV transformer with an isolated or non-isolated AC/DC converter. These are exactly the stages of the sidecar in Architecture 1 (LV input) and of the sidecars in Architectures 2 and 3 (MV input) of the Schneider Electric roadmap.

Schneider Electric WP213: five principles for adoption

Schneider Electric’s white paper 5 Principles for 800 VDC in AI Data Centers: Rack-level Architectures as the Immediate Enabler — published in March 2026, is the reference document of one of the world’s largest energy management manufacturers on the transition to 800 VDC. It identifies 800 VDC power racks — explicitly called sidecars in the abstract — as the immediate enabler of the transition.

The five principles the document proposes are the axes on which designers and operators should evaluate and adopt 800 VDC architectures:

  • Architectural variations. There is no single 800 VDC architecture. The document distinguishes between localised distribution (sidecar), centralised distribution with LV converters and centralised distribution with SST — each with different time horizons, scales and levels of complexity.
  • Ecosystem availability. The maturity of components — SiC rectifiers, WBG DC/DC shelves, connectors, manifolds, protection gear — is the variable that determines when and at what scale each architecture can be deployed.
  • Protection coordination and earthing. The transition to 800 VDC introduces specific challenges in arc fault protection and earthing schemes — 2-wire vs. 3-wire DC — that call for standards review and dedicated protection coordination studies for high-voltage DC.
  • Energy storage integration. Backup systems at 800 V change the sizing logic of the BBU and open the door to LIC or supercapacitor solutions connected directly to the DC bus, without an intermediate conversion stage.
  • Operational execution. Operator training, service procedures in 800 VDC installations, fault management and diagnostic tools are a matter of deep operational change that is not solved by the choice of hardware alone.

The OCP × Current/OS alliance: an open standard for DC

The third vector of the standards ecosystem is the alliance between the OCP Foundation and Current/OS, formalised in December 2025. Current/OS is an independent, non-profit global partnership that promotes open standards for interoperable DC microgrids and is developing a DC standard and DC-certified products for buildings and installations.

The alliance was promoted by the volunteer co-leads of the OCP Power Distribution Project — precisely Eaton and ABB, the same companies co-leading the LVDC white paper. Its stated objective is to combine OCP’s experience in open data centre hardware with the Current/OS standards for interoperable DC, creating what the announcements described as a vendor-neutral operating system for DC-powered data centres.

In addition, on 29 April 2026 — the opening day of the Summit — the OCP Foundation announced a new alliance with the Electric Power Research Institute (EPRI), aimed at integrating the dynamic management of AI data centres with grid services such as demand response, virtual power plants and frequency regulation.

IEC and the European standards landscape

The IEC landscape for LVDC is under active construction, with three standards families of direct relevance to the sidecar. IEC 62477 (Power Electronic Converter Systems) establishes the general safety requirements for power electronic converters, including the DC/DC conversion stages of the sidecar. IEC 62109 (Safety of Power Converters for Use in Photovoltaic Power Systems) provides a precedent for DC converter safety testing methodologies that can be applied by analogy to the data centre context. IEC 60364-8-1 (functional aspects — energy efficiency of low-voltage electrical installations) sets the energy-efficiency framework for the low-voltage installations that host this infrastructure.

Arc fault protection in DC systems above 400 V is one of the least mature areas of the standards landscape for data centre applications. This is both a regulatory risk — installations may require case-by-case assessment by notified bodies — and an opportunity for manufacturers that develop and qualify arc fault protection solutions for the 800 VDC sidecar.

Implications for European power electronics manufacturers

The standards landscape described above has five direct implications for European power electronics manufacturers targeting the data centre market:

  • Mt. Diablo compliance is likely to become a commercial requirement, so component qualification should be planned early.
  • Arc fault protection is an open technical and regulatory problem in which early movers can make a difference.
  • Converter-level telemetry will be required at converter level by operators building on the OCP LVDC architecture.
  • High availability requirements for inference data centres impose MTBF and redundancy requirements consistent with railway and defence-grade power electronics.
  • European traceability requirements under the EU Chips Act and the Cyber Resilience Act will progressively require documented supply chain provenance for critical infrastructure components, including data centre power electronics.

References

  • Open Compute Project Foundation — DCF Power Distribution LVDC white paper (v1.0 approved 29 April 2026; v1.1.0 published subsequently).
  • Schneider Electric — 5 Principles for 800 VDC in AI Data Centers (March 2026).
  • Open Compute Project Foundation and Current/OS — strategic alliance announcement (December 2025).
  • Open Compute Project Foundation and EPRI — alliance announcement (29 April 2026).
  • IEC 62477-1:2022 — Safety requirements for power electronic converter systems and equipment.
  • IEC 60364-8-1:2019 — Low-voltage electrical installations, Part 8-1: Functional aspects, Energy efficiency.
About Premium SA — Premium SA is a Barcelona-based designer and manufacturer of custom power converters for railway, energy, industrial, data centre and defence applications. Founded in 1981, the company brings over 40 years of experience in high-reliability power electronics.

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Del bus 800 V ferroviario al rack de IA
Application Notes, Data Center

From the 800 V Railway Bus to the AI Rack: The Power Conversion Chain Premium Already Knows

Engineering Insight · GaN / HVDC

From the 800 V Railway Bus to the AI Rack: The Power Conversion Chain Premium Already Knows

How experience with 800 V traction converters applies to the 800 VDC sidecar architecture for AI data centres: GaN, the ALL2GaN programme and the EV supply chain.

Contents

  1. The convergence the summit confirmed
  2. ALL2GaN T6.2 Transport: programme context
  3. Why GaN is the sidecar technology
  4. The EV supply chain as a bridge between worlds
  5. Key data points presented at OCP EMEA Summit 2026
  6. Sources

The European ALL2GaN programme closed its thirty-six months of work in April 2026, at the same time as the AI data centre ecosystem was holding its largest annual gathering in Barcelona. The timing is telling: it marks the moment at which European gallium nitride and the high-voltage DC conversion architecture of the data centre converge on the same point of the industrial roadmap. This article reviews the data points presented at the OCP EMEA Summit 2026 that support this convergence with verifiable external evidence.

The convergence the summit confirmed

The convergence between the 800 V bus of railway traction and the 800 V bus of the AI data centre had until recently been a prospective thesis. The OCP EMEA Summit 2026 turned it into an established fact, documented by three independent industrial sources.

Schneider Electric set the limit of the 54 VDC bus at 400 kW/rack — the same threshold above which HVDC architecture becomes necessary, not optional. OmniOn Power quantified the difference: moving from the ORv3 chain (480 V → 54 V → 12 V → core, η 83.8 %) to the Next Gen 800 V chain (480 V → 800 V → 54 V → 12 V → core, η 85.8 %) saves 1.9 percentage points of efficiency — 2 MW for every 100 MW of installed DC capacity. Eaton displayed at the CCIB Innovation Village a physical prototype of the 800 V DC Side Car with a 33 kW ORV3 Power Shelf and scalable DC connectors at 63, 125 and 250 A.

The most significant data point, however, was not a number but a sentence. Schneider Electric, in its Day 2 plenary keynote, justified the 800 V sidecar with four arguments, the last of which was: leverages established EV supply chain. The EV supply chain — the same value chain in which Premium operates with its portfolio of converters for traction, e-mobility and railway auxiliaries — is the argument one of the world’s leading energy management manufacturers used to explain why the 800 V sidecar is the lowest-risk option in the short term.

“48–54 VDC rack power distribution and 480 VAC supply voltage approaches reach practical limits beyond ~400 kW/rack.”

— Schneider Electric, OCP EMEA Summit 2026, Barcelona, 30 April 2026

For a broader overview of the architecture, see The 800 VDC revolution: the energy engine behind AI.

ALL2GaN T6.2 Transport: programme context

The ALL2GaN programme — Affordable smart GaN IC solutions for greener applications — was launched in May 2023 in Villach and closed in April 2026. Coordinated by Infineon Technologies Austria AG, funded by the Chips Joint Undertaking (successor to KDT-JU) and framed within the European Chips Act and the Green Deal, it involved 45 industrial and research partners from twelve European countries.

Premium SA participates in the programme’s Transport cluster as a contributor to the development of compact power electronics building blocks for auxiliary applications. The UC3 use case from the official WP6 M36 deliverable defines the technical context: power converters for traction auxiliaries meeting the temperature, vibration, EMC and reliability requirements of the railway environment certified to EN 50155. This is exactly the design discipline profile the 800 V sidecar for data centres requires.

Why GaN is the sidecar technology

Gallium nitride is not merely an incremental improvement over silicon for DC/DC converters. It is the technology that makes possible the WBG DC/DC shelf stage of the Next Gen 800 V chain — the conversion from 800 V to 54 V at η 98.50 % in a high power density format.

GaN’s advantages over silicon in this context are threefold. First, the switching frequency can be five to ten times higher than conventional silicon, reducing the size of magnetic components and enabling power densities above 40–60 W/in³ on platforms with PCB-integrated planar magnetics. Second, switching losses are dramatically lower, with peak efficiencies above 97–98 % in real operation — not just catalogue conditions. Third, compared to SiC, GaN offers a complementary sweet spot in the medium-voltage, high-frequency band that is exactly the one dominating the WBG DC/DC shelf stage of the 800 V sidecar.

The contribution of the ALL2GaN programme is that these advantages now have a verified industrial value chain in Europe: from substrate to packaging, from reliability to application, production can be carried out entirely within the Union. This answers the industrial sovereignty question the sidecar architecture will face as regulated European hyperscalers demand supply chain traceability for their power components.

The EV supply chain as a bridge between worlds

The Schneider Electric phrase — leverages established EV supply chain — has an immediate practical implication for any power electronics manufacturer with a background in traction or e-mobility.

The components that make the 800 V sidecar possible — high-current DC connectors, high-voltage DC busbars, 4,000–5,000 A DC circuit breakers, copper cables with insulation for 800–1,000 V — are the same components the EV industry has standardised over the past decade. The technical qualifications, insulation tests, DC arc tests and earthing protocols developed for the electric vehicle are directly applicable to the data centre sidecar.

For Premium SA, which has operated for over 40 years in the railway and industrial power electronics supply chain for high-reliability applications, this has a direct technical reading: the company’s industrial track record is not just a credibility antecedent — it is the technical foundation that the sidecar market requires.

Key data points presented at OCP EMEA Summit 2026

Data point Technical implication
54 V bus limit: ~400 kW/rack (Schneider Electric) Defines the threshold above which HVDC distribution becomes necessary. A publicly verifiable data point.
Copper mass 200 kg → 13.5 kg per 1 MW rack (OmniOn Power) Quantifies the physical and material advantage of 800 V distribution.
Chain efficiency gain: +1.9 pp (ORv3 83.8 % → 800 V 85.8 %) (OmniOn Power) Concrete efficiency improvement across the full conversion chain, with public attribution.
“Leverages established EV supply chain” (Schneider Electric) Components, qualifications and test practices from traction and e-mobility carry over to the 800 V sidecar.
Physical 800 V DC Side Car prototype (Eaton) Confirms the architecture has moved from literature to product engineering.

Key takeaway: the convergence of the 800 V bus of railway traction with the 800 V bus of the AI data centre is no longer a thesis but an industry consensus, as the OCP EMEA Summit 2026 confirmed. Schneider Electric set out the case for the sidecar. Eaton showed a physical prototype. OmniOn Power quantified that every 100 MW of DC capacity installed at 800 V instead of 54 V saves 2 MW in losses — and that the copper mass per 1 MW rack drops from 200 to 13.5 kg.

Sources

  • ALL2GaN (Chips JU, formerly KDT-JU) — WP6 M36 public deliverable (UC3, T6.2 Transport).
  • Schneider Electric — keynote, OCP EMEA Summit 2026 (30 April 2026): “Next-generation AI rack densities”, “The sidecar is the immediate enabler.”
  • OmniOn Power — Philip Zuk keynote, OCP EMEA Summit 2026 (29 April 2026): ORv3 vs. 800 V chain and Osprey portfolio.
  • OCP Foundation — DCF Power Distribution LVDC v1.0 (29 April 2026).

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ARTICLE
Data Center, Sin categoría

The 800 VDC revolution: the energy engine behind AI

PREMIUM SA · ENGINEERING INSIGHT · 800 VDC ARCHITECTURE FOR AI · 2026

The 800 VDC revolution: the energy engine behind AI

Why the data center has become an industrial energy plant, and how the sidecar, liquid cooling and observability are redrawing the power architecture.

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Executive summary

In the AI race, the battlefield has moved to physical hardware: data centers are ceasing to be air-conditioned halls and becoming industrial plants for high-precision energy and heat management. Energy efficiency has stopped being a sustainability goal to become the pillar of financial viability.

The technical trigger is the exhaustion of the 48-54 VDC bus. Above roughly 200 kW per rack, copper and heat impose a physical wall. The ecosystem’s answer —reached at the OCP EMEA Summit 2026 in Barcelona— is the move to 800 VDC with local conversion via «sidecar», mandatory liquid cooling and a new observability layer that turns every converter into a managed node. This article explains the why and the how, with figures corrected to authoritative sources.

Note: the source material’s figures have been adjusted to the official values (NVIDIA: −45 % copper, not 93 %; efficiency up to +5 %; water footprint per queries, not per interaction; 1 point = 1 MW/100 MW). The sources section details the traceability.

−45 %Copper with 800 VDC versus 54 VDC (NVIDIA)
≈ 16.7×Less current: ~12,500 A → ~750 A at 600 kW
100–300 kWPer-rack density that forces liquid cooling
1.2 MW800 VDC sidecar target in 2027

Why AI is thirsty for energy

Accelerated computing has changed the rules. Energy and its thermal management have become the dominant share of a modern data center’s operating cost, ahead of hardware and software. And consumption is growing: the International Energy Agency estimates data centers consume around 1.5 % of the world’s electricity today, projected to double by 2030 — the more speculative two-decade projections point to notably larger fractions.

Water is an equally real constraint: available literature places consumption at around 500 ml per 20-50 queries to a language model (not per individual interaction, as is sometimes reported), a figure that becomes decisive at campus scale. And efficiency is measured in money: improving the conversion chain by one percentage point saves on the order of 1 MW per 100 MW installed — at European electricity prices, hundreds of thousands of euros per year per installation. Efficiency is no longer a technical virtue: it is the business model.

The end of the 54 V era: the copper wall

For decades, the 48-54 VDC bus was the gold standard. But powering racks above 200 kW hits a wall of copper and heat: at 54 V, a 1 MW rack would require up to 64U of power hardware alone, with no room for compute. For the power engineer, the leap to 800 VDC is not a new invention but a rediscovery: the same high-voltage-bus and localized-conversion logic that high-speed railway traction has applied since the nineties.

Table 1 — From the 54 V bus to the 800 VDC bus (figures corrected to authoritative source).

Characteristic Traditional architecture (54 V) New architecture (800 VDC) Source
Power limit Tops out above ~200 kW Megawatt-class racks (1 MW from 2027) NVIDIA
Current (600 kW) ≈ 12,500 A ≈ 750 A (≈ 16.7× less) ST / SemiAnalysis
Copper mass (1 MW) ≈ 200 kg of busbar ≈ 45 % reduction; >150 % power through the same conductor NVIDIA (official)
Efficiency / TCO Degraded by ohmic (I²R) losses Up to +5 % end-to-end; TCO −30 % NVIDIA
Technology status Saturated (copper congestion) Scalable (electric-traction heritage) OCP Diablo 400

A note of rigour. An inflated figure circulates: that 800 VDC cuts copper by 93 % (from 200 to 13.5 kg). It is incorrect: it confuses the current ratio (≈16.7×) with the real mass reduction. NVIDIA’s official figure is a reduction close to 45 %, with over 150 % power transmitted through the same conductor. Before an engineering customer, a well-supported 45 % weighs more than a 93 % with no source.

The full transformation is summarized in the schematic below: from the multi-stage AC chain to single-stage 800 VDC distribution with sidecar, liquid cooling and closed-loop observability.

800 vdc
Figure 1 — Power architecture transformation: from the multi-stage AC chain (54 V) to single-stage 800 VDC with sidecar, liquid cooling and observability. Conceptual schematic.

The sidecar: the necessary copilot for 800 VDC

The sidecar is a dedicated power rack, adjacent to the compute rack, that receives alternating current from the data center floor and converts it locally to 800 VDC. As Schneider Electric summarized at the OCP EMEA Summit 2026, «the sidecar is the immediate enabler of 800 VDC». It is not an isolated proposal: Oracle has integrated it into its reference designs and Microsoft is deploying it in its new campuses.

For the operator, it offers three strategic advantages: it enables a non-disruptive upgrade, injecting AI densities into existing AC infrastructures without redesigning the whole building’s electrical system; it isolates the fault domain, confining any electrical incident to a single rack and protecting cluster availability; and it leverages the maturity of the electric-vehicle supply chain (650-700 V semiconductors, 400 V-class capacitors and connectors), accelerating qualification and deployment.

Liquid cooling: when air is no longer enough

Concentrating massive power in small spaces has an inevitable consequence: with densities of 100 to 300 kW per rack, fan-based thermal transfer is physically insufficient. The industry is transitioning to liquid cooling, a systemic shift that moves the focus from building air conditioning to chip-level thermal management. The key components of this new era are industrial, not IT:

  • CDU (Coolant Distribution Units): the heart of the system; they pump the coolant and separate the primary from the secondary loop, enabling heat to be managed directly at the silicon instead of cooling ambient air.
  • Heat exchangers: transfer the thermal energy outward with high efficiency; they are the critical interface for reusing waste heat in industrial networks.
  • Manifolds and secondary loops: precision piping that distributes the flow; they require specific materials and control valves to avoid leaks and pressure drops at high density.
  • Precision pumps and dielectric fluids: maintain constant flows of glycol water or dielectric oils, guaranteeing long-term reliability with no corrosion or electrical conductivity.

The converter as a managed node: Redfish and SCMI

This physical infrastructure needs a brain to coordinate energy and heat in real time, and it elevates the role of the power converter: it ceases to be a passive component to become an intelligent node that speaks two languages — Redfish, the data center management standard, and SCMI, the communication with the silicon. The telemetry and control flow runs the hierarchy DCM → Redfish → sidecar controller → SCMI → silicon, closing a thermal loop: the system reads the chip temperature and, via a PID controller, adjusts power and flow before throttling occurs.

The critical observability tasks are three: expose the CPL0 to CPL3 capping levels (from sustained operation to the critical limit); execute power-capping (POWERCAP) commands in milliseconds so as not to overload the grid; and provide semiconductor and transformer temperature telemetry with tens-of-milliseconds granularity, feeding the thermal PID. Hardware that does not expose this telemetry precisely is left out of the 30-year service contracts.

2027-2030 roadmap

Table 2 — Transition timeline (aligned with the Premium AI Data Center WhitePaper).

Phase Technology milestone Reference power Architecture
2027 Massive deployment of 800 VDC sidecars 1.2 MW / rack High-density hybrid infrastructures
2028-2029 Room-scale centralized DC distribution 5 MW Massive SCMI / Redfish adoption
2030 Solid-state transformers (SST) 10 MW No magnetic transformer; PUE ~1.10

Conclusion: Barcelona at the epicentre

This paradigm shift is a unique industrial opportunity. Barcelona —home to the Barcelona Supercomputing Center, designated a node of the EuroHPC AI Factories with an investment close to €198 million— and Microsoft’s multi-campus expansion in Aragón (with PUE 1.12 and zero water) place the region at the epicentre of European sovereign digital infrastructure. This is not a mere technology upgrade, but an ecosystem where high-fidelity power electronics and industrial thermal management are the new sovereigns. In the AI era, efficiency is not an option: it is the business model.

Sources and traceability

External sources used in this article:

  • 800 VDC: NVIDIA Technical Blog and «800 VDC Architecture» page (−45 % copper, >150 % power per conductor, up to +5 % efficiency, TCO −30 %, maintenance −70 %, 200 kg/rack at 54 V, 1 MW/rack from 2027); ST Blog and SemiAnalysis (≈12,500 A → ≈750 A); OCP Diablo 400; Schneider Electric quote (OCP EMEA 2026).
  • Sustainability: IEA (≈1.5 % of world electricity today, projected to double by 2030); literature on AI water footprint (≈500 ml per 20-50 queries).
  • Spanish hub: EuroHPC JU / BSC-CNS (BSC AI Factory, ≈€198 M, MareNostrum 5 upgrade in 2026); Microsoft communication on Aragón (PUE 1.12, zero water).

About Premium SA

Premium SA is a Barcelona-based manufacturer of electronic power converters for railway, industrial and energy applications. With more than 900 standard product designs and over 40 years of operational experience, Premium SA supplies DC/DC converters, DC/AC inverters, AC/AC frequency converters, battery chargers, rectifiers and UPS systems from 50 W to 72 kW.

As a Barcelona-born industrial company and OCP member, Premium SA brings to the AI ecosystem the 40-year RAMS discipline forged in the most demanding environments —railway traction, substations, defence and energy.

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Premium SA · Barcelona, Spain · info@premiumpsu.com · +34 932 232 685 · www.premiumpsu.com
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